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IPC TM-650 2.2.14.3
Determination of Maximum Solder Powder Particle Size
Organization:
IPC - Association Connecting Electronics Industries
Year: 1995
Abstract: This test method is designed to determine the maximum (average) solder particle size in a solder paste using a fineness of grind gauge.
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IPC TM-650 2.2.14.3
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:41:43Z | |
| date available | 2017-09-04T15:41:43Z | |
| date copyright | 01/01/1995 | |
| date issued | 1995 | |
| identifier other | PHLTCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/44004 | |
| description abstract | This test method is designed to determine the maximum (average) solder particle size in a solder paste using a fineness of grind gauge. | |
| language | English | |
| title | IPC TM-650 2.2.14.3 | num |
| title | Determination of Maximum Solder Powder Particle Size | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1995 | |
| contenttype | fulltext |