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IPC TM-650 2.4.8.1
Peel Strength, Metal Foil (Keyhole Method for Thin Laminates)
Organization:
IPC - Association Connecting Electronics Industries
Year: 1986
Abstract: This method is designed to determine the peel strength of metal foil when bonded to thin laminates. Peel strength is determined for specimens as received or after conditioning, such as solder immersion or elevated temperature exposure.
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IPC TM-650 2.4.8.1
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:45:41Z | |
| date available | 2017-09-04T15:45:41Z | |
| date copyright | 01/01/1986 | |
| date issued | 1986 | |
| identifier other | PSVJCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/48209 | |
| description abstract | This method is designed to determine the peel strength of metal foil when bonded to thin laminates. Peel strength is determined for specimens as received or after conditioning, such as solder immersion or elevated temperature exposure. | |
| language | English | |
| title | IPC TM-650 2.4.8.1 | num |
| title | Peel Strength, Metal Foil (Keyhole Method for Thin Laminates) | en |
| type | standard | |
| page | 3 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1986 | |
| contenttype | fulltext |