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IPC 3408

General Requirements for Anisotropically Conductive Adhesive Films

Organization:
IPC - Association Connecting Electronics Industries
Year: 1996

Abstract: This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-toflexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.
Purpose This standard defines anisotropically conductive adhesive films (also known as Z-axis films, ZAF) through specification of test methods and inspection criteria.
URI: http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/47137
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    IPC 3408

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contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T15:44:42Z
date available2017-09-04T15:44:42Z
date copyright35370
date issued1996
identifier otherPPYOCAAAAAAAAAAA.pdf
identifier urihttp://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/47137
description abstractThis document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-toflexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.
Purpose This standard defines anisotropically conductive adhesive films (also known as Z-axis films, ZAF) through specification of test methods and inspection criteria.
languageEnglish
titleIPC 3408num
titleGeneral Requirements for Anisotropically Conductive Adhesive Filmsen
typestandard
page21
statusActive
treeIPC - Association Connecting Electronics Industries:;1996
contenttypefulltext
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