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IPC 3408
General Requirements for Anisotropically Conductive Adhesive Films
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:44:42Z | |
| date available | 2017-09-04T15:44:42Z | |
| date copyright | 35370 | |
| date issued | 1996 | |
| identifier other | PPYOCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/47137 | |
| description abstract | This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-toflexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product. Purpose This standard defines anisotropically conductive adhesive films (also known as Z-axis films, ZAF) through specification of test methods and inspection criteria. | |
| language | English | |
| title | IPC 3408 | num |
| title | General Requirements for Anisotropically Conductive Adhesive Films | en |
| type | standard | |
| page | 21 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1996 | |
| contenttype | fulltext |
