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IPC TM-650 2.4.13F
Solder Float Resistance Flexible Printed Wiring Materials
Organization:
IPC - Association Connecting Electronics Industries
Year: 1998
Abstract: This test method establishes and defines the procedures for determining the solder float resistance of copper foil clad and bare flexible dielectric material.
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IPC TM-650 2.4.13F
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:46:56Z | |
| date available | 2017-09-04T15:46:56Z | |
| date copyright | 05/01/1998 | |
| date issued | 1998 | |
| identifier other | PWRXHAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/49683 | |
| description abstract | This test method establishes and defines the procedures for determining the solder float resistance of copper foil clad and bare flexible dielectric material. | |
| language | English | |
| title | IPC TM-650 2.4.13F | num |
| title | Solder Float Resistance Flexible Printed Wiring Materials | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1998 | |
| contenttype | fulltext |