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IPC TM-650 2.6.9B
Vibration, Rigid Printed Wiring
Organization:
IPC - Association Connecting Electronics Industries
Year: 2004
Abstract: This test describes a procedure which may be conducted to determine if a printed wiring board is constructed to withstand the dynamic vibrational stresses that may be encountered during field service. This test method provides specific parameters for one application in order to present the proper procedures. Specific test conditions must be agreed upon by the customer and the vendor.
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IPC TM-650 2.6.9B
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:49:59Z | |
| date available | 2017-09-04T15:49:59Z | |
| date copyright | 05/01/2004 | |
| date issued | 2004 | |
| identifier other | QFPHFBAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/53003 | |
| description abstract | This test describes a procedure which may be conducted to determine if a printed wiring board is constructed to withstand the dynamic vibrational stresses that may be encountered during field service. This test method provides specific parameters for one application in order to present the proper procedures. Specific test conditions must be agreed upon by the customer and the vendor. | |
| language | English | |
| title | IPC TM-650 2.6.9B | num |
| title | Vibration, Rigid Printed Wiring | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2004 | |
| contenttype | fulltext |