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IPC 4101C
Specification for Base Materials for Rigid and Multilayer Printed Boards
Organization:
IPC - Association Connecting Electronics Industries
Year: 2009
Abstract: This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:48:04Z | |
| date available | 2017-09-04T15:48:04Z | |
| date copyright | 08/01/2009 | |
| date issued | 2009 | |
| identifier other | QACCOCAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/50986 | |
| description abstract | This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits. | |
| language | English | |
| title | IPC 4101C | num |
| title | Specification for Base Materials for Rigid and Multilayer Printed Boards | en |
| type | standard | |
| page | 144 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2009 | |
| contenttype | fulltext |