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Specification for Base Materials for Rigid and Multilayer Printed Boards

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T15:48:04Z
date available2017-09-04T15:48:04Z
date copyright08/01/2009
date issued2009
identifier otherQACCOCAAAAAAAAAA.pdf
identifier urihttp://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/50986
description abstractThis specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits.
languageEnglish
titleIPC 4101Cnum
titleSpecification for Base Materials for Rigid and Multilayer Printed Boardsen
typestandard
page144
statusActive
treeIPC - Association Connecting Electronics Industries:;2009
contenttypefulltext


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