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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 621-640 of 793
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IPC TM-650 2.4.50
Abstract: This test method defines the procedure for determining the Thermal Conductivity of polymer coatings on inorganic substrates, such as polyimide on a silicon wafer. -
IPC TM-650 2.4.19C
Abstract: This test is to determine the tensile strength and elongation on specimens exposed to mechanical loads. -
IPC TM-650 2.4.14
Abstract: The purpose of this test is to determine the solderability of printed circuit boards (PCBs) that are to be joined by a soldering operation employing rosin flux and immersion in molten solder or by use of a soldering iron. -
IPC DW-426
Abstract: This specification covers the acceptance and test requirements of conformally coated and nonconformally coated discrete wiring assemblies consisting of discrete wiring boards manufactured in accordance with IPC-DW-425 on ... -
IPC TM-650 2.4.8.4
Abstract: To determine the release strength of the carrier of thin copper foil in pounds per inch of width at ambient temperature. -
IPC TM-650 2.4.34.1
Abstract: This test specifies a standard procedure for determining the viscosity of solder paste in the range of 50,000 to 300,000 centipoise. -
IPC MS-810
Abstract: High volume microsection is a process. These guidelines discuss the many variables and problems associated with the process from sample removal to micro-etch. The guidelines do not promote any one vendor’s process, ... -
IPC TM-650 2.4.8.2A
Abstract: The purpose of this test is to determine the peel strength of metal cladding to the base laminate while at elevated temperature; and to evaluate the condition of the base laminate material after the peel strength test is ... -
IPC 1065
Abstract: This handbook has been developed to aid Printed Circuit Board manufacturers and users of Printed Circuit Boards in completing Material Declarations that follow the format and guidance of the Joint Industry Material Composition ... -
IPC TM-650 2.4.18.2
Abstract: This method determines the hot rupture strength of foil by measuring the elevated temperature rupture pressure and the bulge height at rupture. -
IPC A-610E POLISH
Abstract: Niniejszy standard jest zbiorem wymagań dotyczących wizualnej jakościowej dopuszczalności zespołów elektronicznych. Niniejszy dokument prezentuje wymagania dotyczące dopuszczalności ... -
IPC A-311
Abstract: This publication sets forth the information and data which can be collected during the generation and use of phototools with the following objectives and potential benefits: improve artwork quality and thereby improve ... -