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IPC TM-650 2.4.50
Thermal Conductivity, Polymer Films
Organization:
IPC - Association Connecting Electronics Industries
Year: 1995
Abstract: This test method defines the procedure for determining the Thermal Conductivity of polymer coatings on inorganic substrates, such as polyimide on a silicon wafer.
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IPC TM-650 2.4.50
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:56:59Z | |
| date available | 2017-09-04T15:56:59Z | |
| date copyright | 07/01/1995 | |
| date issued | 1995 | |
| identifier other | QZDVCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/60277 | |
| description abstract | This test method defines the procedure for determining the Thermal Conductivity of polymer coatings on inorganic substrates, such as polyimide on a silicon wafer. | |
| language | English | |
| title | IPC TM-650 2.4.50 | num |
| title | Thermal Conductivity, Polymer Films | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1995 | |
| contenttype | fulltext |