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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 601-620 of 793
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IPC 4103A
Abstract: This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital electrical and electronic ... -
IPC TR-582
Abstract: INTRODUCTION
Chlorofluorocarbon (CFC) compounds have been identified as agents contributing to the reduction of stratospheric ozone. In 1986, many nations of the world signed and ratified the Montreal ... -
IPC TM-650 2.4.3.1C
Abstract: With this test method the flexural fatigue life for any given bend radius, the flexural fatigue behavior and the ductility of the conductor metal in percent deformation after tensile failure can be determined.
Note: ... -
IPC TM-650 2.4.42.1
Abstract: The object of this test is to determine the component hold-down capability of the adhesive material at wave soldering temperatures due to material softening or degradation. Test coupons are assembled using the adhesive ... -
IPC 4552 GERMAN
Abstract: This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for ENIG deposit thicknesses ... -
IPC T-50K
Abstract: This document is designed to provide definitions for terms commonly used in the electronics industry which have meanings specific to electronics. The definitions are intended to provide sufficient clarity of detail such ... -
IPC TM-650 2.6.18A
Abstract: This test method defines the procedure for determining the low temperature flexibility of flexible printed wiring materials by flexing while immersed in a solution mixed from dry ice (solid carbon dioxide) and isopropyl alcohol. -
IPC TF-870
Abstract: This specification covers the materials, qualification, certification, and performance requirements for multilayer Polymer Thick Film (PTF) printed, extrusion deposited, or otherwise applied conductor, insulator, and ... -
IPC TM-650 2.3.28.2
Abstract: This test procedure is designed to measure the level of anionic and cationic residues on the surface of unpopulated (bare) printed boards by ion chromatography. -
IPC PD-335 HDBK
Abstract: Purpose of the IPC Electronic Packaging Handbook
The purpose of this Electronic Packaging Handbook is to provide the appropriate insight and flows into the multifaceted topic of electronic packaging. ... -
IPC TM-650 2.3.22
Abstract: This test method is used to determine the presence and effectiveness of the protective coating deposited over the PWB to prevent oxidation and facilitate good wetting during soldering operations. The coating is removed ... -
IPC 2513A
Abstract: This standard specifies data formats used to describe drawing methodologies for printed boards and printed board assemblies. These formats may be used for transmitting information between a printed board designer and a ... -
IPC TM-650 2.4.48
Abstract: This test method provides a measurement of the spitting characteristics of flux-cored wire and ribbon solder. -
IPC TM-650 2.6.6B
Abstract: This test is conducted for the purpose of determining the resistance of a material such as a laminate or multilayer circuit board, to the shock of repeated exposures to extremes of high and low temperatures for comparatively ... -
IPC TM-650 2.5.6B
Abstract: This method describes a procedure for determining the ability of rigid insulating material to resist breakdown parallel to laminations (or in the plane of the material) when subjected to extremely high voltages at standard ... -
IPC TM-650 2.5.5.5C
Abstract: Summary: This method is intended for the rapid measurement of the X-band (8.00 to 12.40 GHz) apparent relative stripline permittivity (see 9.1) and loss tangent of metal clad substrates. Measurements are made under stripline ...