درباره ما
IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 581-600 of 793
-
IPC A-610D VIETNAMESE
Abstract: S¾ch tiÔu chuÌn n¿y l¿ tÎp hïp c¾c qui {Þnh viÙc ch`p nhÎn ch`t lõïng qua trúc quan cho c¾c lÄp r¾p {iÙn tø. T¿i liÙu ... -
IPC J-STD-030A
Abstract: This document provides users of underfill material with guidance in selecting and evaluating underfill material for assembly solder joints second level interconnects. Underfill material is used to increase reliability of ... -
IPC TM-650 2.6.19
Abstract: This test method is to evaluate the insulation resistance of ceramic plated-through hole multilayer printed wiring boards before, during and after the deteriorative effects of the high humidity heat conditions, and low ... -
IPC TM-650 2.4.41.4
Abstract: This test method defines the procedure for determining the Volumetric Thermal Expansion of polymer coatings on inorganic substrates, such as polyimide on a silicon wafer. The expansion is measured using an apparatus designed ... -
IPC TM-650 2.6.9.1
Abstract: The purpose of this test method is to provide a consistent procedure to test the sensitivity of electronic components to ultrasonic energy. There has been a reluctance in the electronics industry to use ultrasonic energy ... -
IPC TM-650 2.3.16.2
Abstract: This method is designed for determining the treated weight of a specific area of prepreg. Treated weight is an alternative to Resin Content Percent as a means of determining the usability and functionality of prepreg. This ... -
IPC 2518A
Abstract: This standard specifies data formats used to describe parts lists and bill of material generation methodologies. These formats may be used for transmitting information between printed board designers, board fabricators, ... -
IPC SM-784
Abstract: This document provides guidelines for the use of Chip-on-Board Technology (hereafter this term may be referenced by the acronym COB). These guidelines include:- Design guidelines,
- Manufacturing ...
-
IPC TM-650 2.2.1A
Abstract: This method is intended to cover all mechanical dimension inspections typically referenced on a Printed Board drawing. This will cover non-optically enhanced measurement techniques which are not covered by IPC-TM-650, ... -
IPC 2588
Abstract: This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and ... -
IPC TM-650 2.3.1.1B
Abstract: This method evaluates the chemical cleanability of metal clad laminates surfaces of oxidation and anti-oxidation protective coatings. -
IPC TM-650 2.4.16B
Abstract: This method covers the determination of the force required to initiate tearing in flexible insulating materials. It is based on ASTM D1004. -
IPC HDBK-850
Abstract: For the purpose of this document potting can be thought of as the ‘‘liquid material'' and encapsulation can be interpreted as the application process and cure. Please keep in mind however that the terms potting ... -
IPC TM-650 2.4.34.2
Abstract: The test specifies a standard procedure for determining the viscosity of solder paste in the range of 300,000 to 1,600,000 centipoise.