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IPC SM-784
Guidelines for Chip-on- Board Technology Implementation
Organization:
IPC - Association Connecting Electronics Industries
Year: 1990
Abstract: This document provides guidelines for the use of Chip-on-Board Technology (hereafter this term may be referenced by the acronym COB). These guidelines include:
Purpose
COB is the logical extension of hybrid circuit technology, but with addiuonal advantages to be discussed later. This document is intended to be an aid to the provider or user of COB technology by providing guidelines for its successful implementation as a continuation of the evolution of electronic assembly from through-hole mount to surface mount and on to the finer pitch of COB.
- Design guidelines,
- Manufacturing information,
- Assembly guiddines,
- Testing guidelines, and
- Bibliographic references.
Purpose
COB is the logical extension of hybrid circuit technology, but with addiuonal advantages to be discussed later. This document is intended to be an aid to the provider or user of COB technology by providing guidelines for its successful implementation as a continuation of the evolution of electronic assembly from through-hole mount to surface mount and on to the finer pitch of COB.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:08:28Z | |
| date available | 2017-09-04T16:08:28Z | |
| date copyright | 33178 | |
| date issued | 1990 | |
| identifier other | SEEXCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/71684 | |
| description abstract | This document provides guidelines for the use of Chip-on-Board Technology (hereafter this term may be referenced by the acronym COB). These guidelines include:
Purpose COB is the logical extension of hybrid circuit technology, but with addiuonal advantages to be discussed later. This document is intended to be an aid to the provider or user of COB technology by providing guidelines for its successful implementation as a continuation of the evolution of electronic assembly from through-hole mount to surface mount and on to the finer pitch of COB. | |
| language | English | |
| title | IPC SM-784 | num |
| title | Guidelines for Chip-on- Board Technology Implementation | en |
| type | standard | |
| page | 53 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1990 | |
| contenttype | fulltext |