IPC SM-784

Guidelines for Chip-on- Board Technology Implementation

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T16:08:28Z
date available	2017-09-04T16:08:28Z
date copyright	33178
date issued	1990
identifier other	SEEXCAAAAAAAAAAA.pdf
identifier uri	http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/71684
description abstract	This document provides guidelines for the use of Chip-on-Board Technology (hereafter this term may be referenced by the acronym COB). These guidelines include: Design guidelines, Manufacturing information, Assembly guiddines, Testing guidelines, and Bibliographic references. Purpose COB is the logical extension of hybrid circuit technology, but with addiuonal advantages to be discussed later. This document is intended to be an aid to the provider or user of COB technology by providing guidelines for its successful implementation as a continuation of the evolution of electronic assembly from through-hole mount to surface mount and on to the finer pitch of COB.
language	English
title	IPC SM-784	num
title	Guidelines for Chip-on- Board Technology Implementation	en
type	standard
page	53
status	Active
tree	IPC - Association Connecting Electronics Industries:;1990
contenttype	fulltext