درباره ما
IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 561-580 of 793
-
IPC 7711B/7721B SPANISH
Abstract: Este documento cubre los procedimientos para reparación y retrabajo de ensambles de tarjetas de circuito impreso. Es un conjunto de información reunida, integrada, y ensamblada por el ‘‘Reparability ... -
IPC IPC/JEDEC J-STD-035
Abstract: This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. This method provides users with an acoustic microscopy process flow for detecting defects ... -
IPC TM-650 2.4.14.1
Abstract: This document is intended to provide a recommended test method, which may be used by both vendor and user to determine solderability of PWBs, with or without surface coatings, which will be soldered by wave soldering machine ... -
IPC TM-650 2.1.6B
Abstract: This method is designed to determine the thickness of woven glass fabric, such as E-glass, S-glass, and quartz, used as reinforcement in prepreg (resin-impregnated glass fabric, or B-stage). It is applicable for glass ... -
IPC TM-650 2.5.5.2A
Abstract: This test method is to determine the dielectric constant and dissipation factor of raw printed wiring board material at 1 MHz. -
IPC IPC/WHMA-A-620A FRENCH
Abstract: Cette norme est un catalogue de critères visuels, électriques et mécaniques d'acceptation pour l'assemblage des câbles et des faisceaux de câbles. Il a été élaboré par l'ITGC, ... -
IPC TA-721
Abstract: An overview for each section
To provide you with an insight into each section, we have asked various industry experts to provide overviews of the material covered in each section. These overviews ... -
IPC 1331
Abstract: This voluntary standard establishes minimum requirements for the design, installation, operation and maintenance of electrically heated process equipment in order to minimize electrical hazards and prevent fires that may ... -
IPC TM-650 2.4.24.3
Abstract: This test method establishes a procedure for determining the glass transition temperature of organic films using thermal mechanical analysis (TMA). -
IPC CI-408
Abstract: With the present packaging trend in systems moving towards high speed, compact configurations, the use of Surface Mount Technology offers a viable approach toward achieving the desired packaging goals. The degree of ... -
IPC TM-650 2.5.5.11
Abstract: This method specifies time domain reflectometry (TDR) methods for measuring and calculating the propagation delay of uniform, controlled impedance transmission lines fabricated in printed board (PB) technology. The method ... -
IPC TM-650 1.9 GUIDE
Abstract: Introduction
Welcome to the Measurement Precision Calculator. This utility will help perform the calculations for Measurement Systems Analysis (MSA) described in the IPC Test Method IPC-TM-1.9.
This ...