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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 541-560 of 793
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IPC IPC/WHMA-A-620A DANISH
Abstract: Denne standard er en samling af visuelle, elektriske og mekaniske kvalitetskrav for kabler, ledninger og produkter med wire harness. Den er udviklet af ‘‘the Industry Technical Guidelines Committee of the Wire ... -
IPC TM-650 2.5.33.2
Abstract: This test method deals only with transients generated within the Unit Under Test (UUT) and not with transients originating elsewhere (i.e., power line transients), which propagate through the UUT. This procedure measures ... -
IPC TM-650 2.6.28
Abstract: Moisture absorption can cause delamination or other damage in printed boards subjected to soldering heat. This test is a process control tool to determine both the bulk moisture content and moisture absorption rate of a ... -
IPC 9201A
Abstract: This document is intended to cover the broad spectrum of temperature-humidity (TH) testing, associated terminology, and suggested techniques for proper testing. This edition of the Handbook primarily covers the test methods ... -
IPC TR-465-2
Abstract: Introduction
At a meeting in February of 1989, the Institute for Interconnecting and Packaging Electronics Circuits (IPC) and the Electronic Industries Association (EIA) agreed to co-author a joint ... -
IPC TM-650 2.6.26
Abstract: This test measures changes in resistance of plated-through hole barrels and internal layer connections as holes are subjected to thermal cycling. Thermal cycling is produced by the application of a current through a specific ... -
IPC TM-650 2.2.2B
Abstract: This method is intended to describe optically enhanced measurement techniques for dimensions of 3 mm or less, typically referenced on a Printed Board drawing. This method will not cover mechanical dimensional verification ... -
IPC TM-650 2.3.18A
Abstract: The purpose of this test method is to provide a procedure for determining the gel time of resin preimpregnated "B" Stage glass fabric. -
IPC J-STD-032
Abstract: This standard establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages. All BGA terminals shall meet the designated standards detailed in this document and ... -
IPC TM-650 2.6.12
Abstract: This test method describes the procedure for temperature testing of flat cable. -
IPC TR-465-3
Abstract: The purpose of this round robin test program is to determine the effect of the steam aging environment at fixed temperatures on the various metals and platings used on electronic components and printed wiring boards. Many ... -
IPC TM-650 2.5.16A
Abstract: This test method is to detect internal electrical short circuits within multilayer printed wiring boards. -
IPC TM-650 2.2.17A
Abstract: This method defines the procedure for determining the roughness or profile of metallic foils. The surface finish or roughness of foils shall be evaluated using Ra. Ra is defined as the arithmetic average value of all ... -
IPC TM-650 2.4.1.4
Abstract: This test method is to determine the adhesion quality of overglaze materials on the substrate surface of finished hybrid circuits. -
IPC 9203
Abstract: INTRODUCTION
Of the various methods for the determination of ionic residues, the method of choice is ion chromatography, which determines both the type of ionic residue and the amount present. The IPC ... -
IPC TM-650 2.5.21A
Abstract: This test method gives a procedure to determine crosstalk or the magnitude of disturbance that is coupled to one conductor when another conductor in a given cable configuration is activated with a pulse. -
IPC TM-650 2.3.4.3
Abstract: This test method is designed for use in determining the resistance of core (dielectric) materials used in printed wiring boards to methylene chloride at laboratory ambient temperature.