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IPC TM-650 2.2.2B
Optical Dimensional Verification
Organization:
IPC - Association Connecting Electronics Industries
Year: 1997
Abstract: This method is intended to describe optically enhanced measurement techniques for dimensions of 3 mm or less, typically referenced on a Printed Board drawing. This method will not cover mechanical dimensional verification which is covered by IPC-TM-650, Method 2.2.1. This method is intended to supersede IPC-TM-650, Method 2.2.3.
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IPC TM-650 2.2.2B
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:20:26Z | |
| date available | 2017-09-04T16:20:26Z | |
| date copyright | 08/01/1997 | |
| date issued | 1997 | |
| identifier other | TKTXCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/83858 | |
| description abstract | This method is intended to describe optically enhanced measurement techniques for dimensions of 3 mm or less, typically referenced on a Printed Board drawing. This method will not cover mechanical dimensional verification which is covered by IPC-TM-650, Method 2.2.1. This method is intended to supersede IPC-TM-650, Method 2.2.3. | |
| language | English | |
| title | IPC TM-650 2.2.2B | num |
| title | Optical Dimensional Verification | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1997 | |
| contenttype | fulltext |