درباره ما
IPC TR-465-3
Evaluation of Steam Aging on Alternative Finishes Round Robin Test Program Phase IIA
Organization:
IPC - Association Connecting Electronics Industries
Year: 1996
Abstract: The purpose of this round robin test program is to determine the effect of the steam aging environment at fixed temperatures on the various metals and platings used on electronic components and printed wiring boards. Many studies have been performed by various industry representatives. This round robin capitalizes on this work to help establish correlations between various testers in order to verify the effect of steam aging on solderability and explore test repeatability and reproducibility.
Collections
:
Show full item record
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:19:46Z | |
| date available | 2017-09-04T16:19:46Z | |
| date copyright | 07/01/1996 | |
| date issued | 1996 | |
| identifier other | BLVYCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/83201 | |
| description abstract | The purpose of this round robin test program is to determine the effect of the steam aging environment at fixed temperatures on the various metals and platings used on electronic components and printed wiring boards. Many studies have been performed by various industry representatives. This round robin capitalizes on this work to help establish correlations between various testers in order to verify the effect of steam aging on solderability and explore test repeatability and reproducibility. | |
| language | English | |
| title | IPC TR-465-3 | num |
| title | Evaluation of Steam Aging on Alternative Finishes Round Robin Test Program Phase IIA | en |
| type | standard | |
| page | 21 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1996 | |
| contenttype | fulltext |