IPC TR-465-3

Evaluation of Steam Aging on Alternative Finishes Round Robin Test Program Phase IIA

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T16:19:46Z
date available	2017-09-04T16:19:46Z
date copyright	07/01/1996
date issued	1996
identifier other	BLVYCAAAAAAAAAAA.pdf
identifier uri	http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/83201
description abstract	The purpose of this round robin test program is to determine the effect of the steam aging environment at fixed temperatures on the various metals and platings used on electronic components and printed wiring boards. Many studies have been performed by various industry representatives. This round robin capitalizes on this work to help establish correlations between various testers in order to verify the effect of steam aging on solderability and explore test repeatability and reproducibility.
language	English
title	IPC TR-465-3	num
title	Evaluation of Steam Aging on Alternative Finishes Round Robin Test Program Phase IIA	en
type	standard
page	21
status	Active
tree	IPC - Association Connecting Electronics Industries:;1996
contenttype	fulltext