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IPC J-STD-032
Performance Standard for Ball Grid Array Balls
Organization:
IPC - Association Connecting Electronics Industries
Year: 2002
Abstract: This standard establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages. All BGA terminals shall meet the designated standards detailed in this document and includes such diverse terminations as solder balls. The specific standards for different terminations will therefore be appropriately matched to the particular interconnection.
Purpose
The purpose of this document is to establish for the manufacturer and user of ball grid array devices, a set of designations and expectations for product performance. Included in the product performance will be the flexibility to implement the best commercial practices.
Intent
The intent is to recognize a large variety of terminal structures for a wide range of applications ranging from highest reliability computer, space and military applications to disposable commodity applications. Subsections in this document will provide for the flexibility to meet the cost and performance requirements of the variations.
Terms and Definitions
Appendices A and B are lists of terminology and acronyms related to this standard.
Purpose
The purpose of this document is to establish for the manufacturer and user of ball grid array devices, a set of designations and expectations for product performance. Included in the product performance will be the flexibility to implement the best commercial practices.
Intent
The intent is to recognize a large variety of terminal structures for a wide range of applications ranging from highest reliability computer, space and military applications to disposable commodity applications. Subsections in this document will provide for the flexibility to meet the cost and performance requirements of the variations.
Terms and Definitions
Appendices A and B are lists of terminology and acronyms related to this standard.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:20:05Z | |
| date available | 2017-09-04T16:20:05Z | |
| date copyright | 06/01/2002 | |
| date issued | 2002 | |
| identifier other | TJUWABAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/83493 | |
| description abstract | This standard establishes the construction detail requirements for balls and other terminal structures on Ball Grid Array (BGA) packages. All BGA terminals shall meet the designated standards detailed in this document and includes such diverse terminations as solder balls. The specific standards for different terminations will therefore be appropriately matched to the particular interconnection. Purpose The purpose of this document is to establish for the manufacturer and user of ball grid array devices, a set of designations and expectations for product performance. Included in the product performance will be the flexibility to implement the best commercial practices. Intent The intent is to recognize a large variety of terminal structures for a wide range of applications ranging from highest reliability computer, space and military applications to disposable commodity applications. Subsections in this document will provide for the flexibility to meet the cost and performance requirements of the variations. Terms and Definitions Appendices A and B are lists of terminology and acronyms related to this standard. | |
| language | English | |
| title | IPC J-STD-032 | num |
| title | Performance Standard for Ball Grid Array Balls | en |
| type | standard | |
| page | 20 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2002 | |
| contenttype | fulltext |