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IPC TM-650 2.5.5.2A
Dielectric Constant and Dissipation Factor of Printed Wiring Board Material - Clip Method
Organization:
IPC - Association Connecting Electronics Industries
Year: 1987
Abstract: This test method is to determine the dielectric constant and dissipation factor of raw printed wiring board material at 1 MHz.
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IPC TM-650 2.5.5.2A
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:14:43Z | |
| date available | 2017-09-04T16:14:43Z | |
| date copyright | 32112 | |
| date issued | 1987 | |
| identifier other | SVAVNAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/77998 | |
| description abstract | This test method is to determine the dielectric constant and dissipation factor of raw printed wiring board material at 1 MHz. | |
| language | English | |
| title | IPC TM-650 2.5.5.2A | num |
| title | Dielectric Constant and Dissipation Factor of Printed Wiring Board Material - Clip Method | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1987 | |
| contenttype | fulltext |