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IPC IPC/JEDEC J-STD-035
Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
Organization:
IPC - Association Connecting Electronics Industries
Year: 1999
Abstract: This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. This method provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility.
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IPC IPC/JEDEC J-STD-035
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:15:49Z | |
| date available | 2017-09-04T16:15:49Z | |
| date copyright | 04/01/1999 | |
| date issued | 1999 | |
| identifier other | SYEDKAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/79115 | |
| description abstract | This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. This method provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility. | |
| language | English | |
| title | IPC IPC/JEDEC J-STD-035 | num |
| title | Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components | en |
| type | standard | |
| page | 20 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1999 | |
| contenttype | fulltext |