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Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T16:15:49Z
date available2017-09-04T16:15:49Z
date copyright04/01/1999
date issued1999
identifier otherSYEDKAAAAAAAAAAA.pdf
identifier urihttp://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/79115
description abstractThis test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. This method provides users with an acoustic microscopy process flow for detecting defects non-destructively in plastic packages while achieving reproducibility.
languageEnglish
titleIPC IPC/JEDEC J-STD-035num
titleAcoustic Microscopy for Non-Hermetic Encapsulated Electronic Componentsen
typestandard
page20
statusActive
treeIPC - Association Connecting Electronics Industries:;1999
contenttypefulltext


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