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IPC TM-650 2.4.14.1
Solderability, Wave Solder Method
Organization:
IPC - Association Connecting Electronics Industries
Year: 1979
Abstract: This document is intended to provide a recommended test method, which may be used by both vendor and user to determine solderability of PWBs, with or without surface coatings, which will be soldered by wave soldering machine methods or other soldering devices. The solderability determination is made to verify that the printed wiring fabrication processes and storage have had no adverse effect on the solderability of the PWB. This is determined by evaluating the ability of those portions of the PWB normally soldered to be wetted by a new coat of solder. Determination is judged visibly by non-destructive methods. The standard does not specifically relate to the solderability of the walls of plated-through holes (PTHs) but may be used for that purpose. This standard shall not be construed as a production procedure for preparing and soldering PWBs.
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IPC TM-650 2.4.14.1
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:15:15Z | |
| date available | 2017-09-04T16:15:15Z | |
| date copyright | 03/01/1979 | |
| date issued | 1979 | |
| identifier other | SWKMCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/78461 | |
| description abstract | This document is intended to provide a recommended test method, which may be used by both vendor and user to determine solderability of PWBs, with or without surface coatings, which will be soldered by wave soldering machine methods or other soldering devices. The solderability determination is made to verify that the printed wiring fabrication processes and storage have had no adverse effect on the solderability of the PWB. This is determined by evaluating the ability of those portions of the PWB normally soldered to be wetted by a new coat of solder. Determination is judged visibly by non-destructive methods. The standard does not specifically relate to the solderability of the walls of plated-through holes (PTHs) but may be used for that purpose. This standard shall not be construed as a production procedure for preparing and soldering PWBs. | |
| language | English | |
| title | IPC TM-650 2.4.14.1 | num |
| title | Solderability, Wave Solder Method | en |
| type | standard | |
| page | 3 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1979 | |
| contenttype | fulltext |