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IPC TF-870

Qualification and Performance of Polymer Thick Film Printed Boards

Organization:
IPC - Association Connecting Electronics Industries
Year: 1989

Abstract: This specification covers the materials, qualification, certification, and performance requirements for multilayer Polymer Thick Film (PTF) printed, extrusion deposited, or otherwise applied conductor, insulator, and through-hole technology. Printed, extrusion deposited, or otherwise applied circuitry, shall meet all applicable requirements of this specification and the master drawing. Etched and plated conventional printed circuits may also be an integral part of this technology. This specification may also be used for procurement of single-sided and double-sided boards. See Figures 1, 2, and 3.
URI: http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/64526
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    IPC TF-870

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contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T16:01:18Z
date available2017-09-04T16:01:18Z
date copyright32813
date issued1989
identifier otherRKSSCAAAAAAAAAAA.pdf
identifier urihttp://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/64526
description abstractThis specification covers the materials, qualification, certification, and performance requirements for multilayer Polymer Thick Film (PTF) printed, extrusion deposited, or otherwise applied conductor, insulator, and through-hole technology. Printed, extrusion deposited, or otherwise applied circuitry, shall meet all applicable requirements of this specification and the master drawing. Etched and plated conventional printed circuits may also be an integral part of this technology. This specification may also be used for procurement of single-sided and double-sided boards. See Figures 1, 2, and 3.
languageEnglish
titleIPC TF-870num
titleQualification and Performance of Polymer Thick Film Printed Boardsen
typestandard
page30
statusActive
treeIPC - Association Connecting Electronics Industries:;1989
contenttypefulltext
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