IPC TF-870

Qualification and Performance of Polymer Thick Film Printed Boards

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T16:01:18Z
date available	2017-09-04T16:01:18Z
date copyright	32813
date issued	1989
identifier other	RKSSCAAAAAAAAAAA.pdf
identifier uri	http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/64526
description abstract	This specification covers the materials, qualification, certification, and performance requirements for multilayer Polymer Thick Film (PTF) printed, extrusion deposited, or otherwise applied conductor, insulator, and through-hole technology. Printed, extrusion deposited, or otherwise applied circuitry, shall meet all applicable requirements of this specification and the master drawing. Etched and plated conventional printed circuits may also be an integral part of this technology. This specification may also be used for procurement of single-sided and double-sided boards. See Figures 1, 2, and 3.
language	English
title	IPC TF-870	num
title	Qualification and Performance of Polymer Thick Film Printed Boards	en
type	standard
page	30
status	Active
tree	IPC - Association Connecting Electronics Industries:;1989
contenttype	fulltext