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IPC IPC/JEDEC-9703

Mechanical Shock Test Guidelines for Solder Joint Reliability

Organization:
IPC - Association Connecting Electronics Industries
Year: 2009

Abstract: This document establishes mechanical shock test guidelines for assessing solder joint reliability of Printed Circuit Board (PCB) assemblies from system to component level.
The three main categories discussed within this document follow:
1. Methods to define mechanical shock use-conditions.
2. Methods to define system level, system board level and component test board level testing that correlate to the use-conditions.
3. Guidance on the use of experimental metrologies for mechanical shock tests.
 
URI: http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/46912
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    IPC IPC/JEDEC-9703

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contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T15:44:31Z
date available2017-09-04T15:44:31Z
date copyright03/01/2009
date issued2009
identifier otherPPJOLCAAAAAAAAAA.pdf
identifier urihttp://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/46912
description abstractThis document establishes mechanical shock test guidelines for assessing solder joint reliability of Printed Circuit Board (PCB) assemblies from system to component level.
The three main categories discussed within this document follow:
1. Methods to define mechanical shock use-conditions.
2. Methods to define system level, system board level and component test board level testing that correlate to the use-conditions.
3. Guidance on the use of experimental metrologies for mechanical shock tests.
 
languageEnglish
titleIPC IPC/JEDEC-9703num
titleMechanical Shock Test Guidelines for Solder Joint Reliabilityen
typestandard
page48
statusActive
treeIPC - Association Connecting Electronics Industries:;2009
contenttypefulltext
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