IPC IPC/JEDEC-9703

Mechanical Shock Test Guidelines for Solder Joint Reliability

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T15:44:31Z
date available	2017-09-04T15:44:31Z
date copyright	03/01/2009
date issued	2009
identifier other	PPJOLCAAAAAAAAAA.pdf
identifier uri	http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/46912
description abstract	This document establishes mechanical shock test guidelines for assessing solder joint reliability of Printed Circuit Board (PCB) assemblies from system to component level. The three main categories discussed within this document follow: 1. Methods to define mechanical shock use-conditions. 2. Methods to define system level, system board level and component test board level testing that correlate to the use-conditions. 3. Guidance on the use of experimental metrologies for mechanical shock tests.
language	English
title	IPC IPC/JEDEC-9703	num
title	Mechanical Shock Test Guidelines for Solder Joint Reliability	en
type	standard
page	48
status	Active
tree	IPC - Association Connecting Electronics Industries:;2009
contenttype	fulltext