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IPC TM-650 2.6.4B
Outgassing, Printed Boards
Organization:
IPC - Association Connecting Electronics Industries
Year: 2004
Abstract: This test method is used to determine the total mass loss (TML) and collected volatile condensable material (CVCM) of materials when exposed to a heated vacuum environment. Mass loss may be due to outgassing of low molecular weight materials present in printed boards such as trapped plating solutions, improper lamination, and uncured adhesives which are known to cause contamination or corrosion of spacecraft equipment.
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IPC TM-650 2.6.4B
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:49:38Z | |
| date available | 2017-09-04T15:49:38Z | |
| date copyright | 05/01/2004 | |
| date issued | 2004 | |
| identifier other | QEPHFBAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/52644 | |
| description abstract | This test method is used to determine the total mass loss (TML) and collected volatile condensable material (CVCM) of materials when exposed to a heated vacuum environment. Mass loss may be due to outgassing of low molecular weight materials present in printed boards such as trapped plating solutions, improper lamination, and uncured adhesives which are known to cause contamination or corrosion of spacecraft equipment. | |
| language | English | |
| title | IPC TM-650 2.6.4B | num |
| title | Outgassing, Printed Boards | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2004 | |
| contenttype | fulltext |