درباره ما
ECA 540HAAA
Detail Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment
Organization:
ECIA - Electronic Components Industry Association
Year: 2000
Abstract: The ball grid array (BGA) burn-in sockets of assessed quality covered by this Detail Specification have:
— Maximum enclosure dimensions as shown in figure 2.
— A working voltage not exceeding 250 volts (rms).
— Current rating not exceeding 1 ampere per pin.
Object
The object of this Detail Specification is to provide all information required for the identification and quality assessment of the burn-in socket for ball grid array devices described herein by the EIA. The information, contained herein or by reference, is complete and sufficient for inspection purposes.
— Maximum enclosure dimensions as shown in figure 2.
— A working voltage not exceeding 250 volts (rms).
— Current rating not exceeding 1 ampere per pin.
Object
The object of this Detail Specification is to provide all information required for the identification and quality assessment of the burn-in socket for ball grid array devices described herein by the EIA. The information, contained herein or by reference, is complete and sufficient for inspection purposes.
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| contributor author | ECIA - Electronic Components Industry Association | |
| date accessioned | 2017-09-04T15:14:40Z | |
| date available | 2017-09-04T15:14:40Z | |
| date copyright | 06/01/2000 | |
| date issued | 2000 | |
| identifier other | MECMMAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=authoF23793FD08/handle/yse/13552 | |
| description abstract | The ball grid array (BGA) burn-in sockets of assessed quality covered by this Detail Specification have: — Maximum enclosure dimensions as shown in figure 2. — A working voltage not exceeding 250 volts (rms). — Current rating not exceeding 1 ampere per pin. Object The object of this Detail Specification is to provide all information required for the identification and quality assessment of the burn-in socket for ball grid array devices described herein by the EIA. The information, contained herein or by reference, is complete and sufficient for inspection purposes. | |
| language | English | |
| title | ECA 540HAAA | num |
| title | Detail Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment | en |
| type | standard | |
| page | 32 | |
| status | Active | |
| tree | ECIA - Electronic Components Industry Association:;2000 | |
| contenttype | fulltext |