ECA 540HAAA

Detail Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment

contributor author	ECIA - Electronic Components Industry Association
date accessioned	2017-09-04T15:14:40Z
date available	2017-09-04T15:14:40Z
date copyright	06/01/2000
date issued	2000
identifier other	MECMMAAAAAAAAAAA.pdf
identifier uri	http://mapnamagz.yabesh.ir/std;query=authoF23793FD08/handle/yse/13552
description abstract	The ball grid array (BGA) burn-in sockets of assessed quality covered by this Detail Specification have: — Maximum enclosure dimensions as shown in figure 2. — A working voltage not exceeding 250 volts (rms). — Current rating not exceeding 1 ampere per pin. Object The object of this Detail Specification is to provide all information required for the identification and quality assessment of the burn-in socket for ball grid array devices described herein by the EIA. The information, contained herein or by reference, is complete and sufficient for inspection purposes.
language	English
title	ECA 540HAAA	num
title	Detail Specification for Burn-In Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment	en
type	standard
page	32
status	Active
tree	ECIA - Electronic Components Industry Association:;2000
contenttype	fulltext