درباره ما
SMD-5962-89449 REV A
MICROCIRCUITS, DIGITAL, HIGH PERFORMANCE CHMOS III, NUMERIC PROCESSOR EXTENSION, MONOLITHIC SILICON
Year: 1994
Abstract: This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".
The complete PIN shall be as shown in the following example:![CHART]()
The device type(s) shall identify the circuit function as follows:
The case outline(s) shall be as designated in MIL-STD-1835, and as follows:
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein). Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Intended Use: Microcircuits conforming to this drawing are intended for Government microcircuit applications (original equipment), design applications, and logisicts purposes.
The complete PIN shall be as shown in the following example:
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function Frequency 01 80C187-10 80-bit numeric processor extension 10 MHz 02 80C187-12 80-bit numeric processor extension 12 MHz 03 80C187-16 80-bit numeric processor extension 16 MHz
The case outline(s) shall be as designated in MIL-STD-1835, and as follows:
Outline letter Descriptive designator Terminals Package style Q GDIP1-T40 or CDIP2-T40 40 Dual-in-line package X See figure 1 68 Ceramic quad flat package
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein). Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Storage temperature range - - - - - - - - - - - - - - - - - - - - - - - - - - - - −65°C to +150°C Voltage on any pin (respect to ground) - - - - - - - - - - - - - - - - - - - - - −0.5 V to VCC + 0.5 V Maximum power dissipation (PD) - - - - - - - - - - - - - - - - - - - - - - - - - 750 mW Lead temperature (soldering 10 seconds) - - - - - - - - - - - - - - - - - - - - - +275°C Thermal resistance, junction-to-case (θJC): Case Q - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - See MIL-STD-1835 Case X - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 8.5°C/W Junction temperature (TJ) - - - - - - - - - - - - - - - - - - - - - - - - - - - - +150°C
Case operating temperature range - - - - - - - - - - - - - - - - - - - - - - - - −55°C to +125°C Supply voltage (VCC)- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4.75 V dc to 5.25 V dc Frequency of operation: Device type 01 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 10 MHz Device type 02 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 12.5 MHz Device type 03 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 16 MHz
Intended Use: Microcircuits conforming to this drawing are intended for Government microcircuit applications (original equipment), design applications, and logisicts purposes.
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