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MICROCIRCUITS, DIGITAL, HIGH PERFORMANCE CHMOS III, NUMERIC PROCESSOR EXTENSION, MONOLITHIC SILICON

contributor authorDLA - CC - DLA Land and Maritime
date accessioned2017-09-04T18:33:38Z
date available2017-09-04T18:33:38Z
date copyright34684
date issued1994
identifier otherJEQYDAAAAAAAAAAA.pdf
identifier urihttp://mapnamagz.yabesh.ir/std;query=autho1826AF67FCdardstandardsfen/handle/yse/215886
description abstractThis drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".
The complete PIN shall be as shown in the following example: CHART
The device type(s) shall identify the circuit function as follows:
  Device type         Generic number                  Circuit function                Frequency        01                 80C187-10             80-bit numeric processor extension       10 MHz       02                 80C187-12             80-bit numeric processor extension       12 MHz       03                 80C187-16             80-bit numeric processor extension       16 MHz


The case outline(s) shall be as designated in MIL-STD-1835, and as follows:
  Outline letter        Descriptive designator          Terminals           Package style          Q               GDIP1-T40 or CDIP2-T40             40           Dual-in-line package         X               See figure 1                       68           Ceramic quad flat package


The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein). Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Storage temperature range - - - - - - - - - - - - - - - - - - - - - - - - - - - -     −65°C to +150°C Voltage on any pin (respect to ground)  - - - - - - - - - - - - - - - - - - - - -     −0.5 V to VCC + 0.5 V Maximum power dissipation (PD)  - - - - - - - - - - - - - - - - - - - - - - - - -     750 mW Lead temperature (soldering 10 seconds) - - - - - - - - - - - - - - - - - - - - -     +275°C Thermal resistance, junction-to-case (θJC):    Case Q - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -     See MIL-STD-1835    Case X - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -     8.5°C/W Junction temperature (TJ) - - - - - - - - - - - - - - - - - - - - - - - - - - - -     +150°C


Case operating temperature range  - - - - - - - - - - - - - - - - - - - - - - - -     −55°C to +125°C Supply voltage (VCC)- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -     4.75 V dc to 5.25 V dc Frequency of operation:    Device type 01 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -     10 MHz    Device type 02 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -     12.5 MHz    Device type 03 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -     16 MHz


Intended Use: Microcircuits conforming to this drawing are intended for Government microcircuit applications (original equipment), design applications, and logisicts purposes.
languageEnglish
titleSMD-5962-89449 REV Anum
titleMICROCIRCUITS, DIGITAL, HIGH PERFORMANCE CHMOS III, NUMERIC PROCESSOR EXTENSION, MONOLITHIC SILICONen
typestandard
page19
statusActive
treeDLA - CC - DLA Land and Maritime:;1994
contenttypefulltext


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