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MSFC-PROC-3144
DETAILED PROCESS INSTRUCTION FOR BONDING FLEXIBLE REUSABLE SURFACE INSULATION (FRSI) WITH RTV 566
Organization:
MSFC - NASA - MSFC - Marshall Space Flight Center
Year: 2001
Abstract: This detailed process instruction (DPI) is to be used for bonding flexible reusable surface insulation (FRSI) in accordance with X38-DPS design requirements.
This DPI addresses the surface preparation and bonding of FRSI material to substrate surface(s).
This DPI addresses the surface preparation and bonding of FRSI material to substrate surface(s).
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| contributor author | MSFC - NASA - MSFC - Marshall Space Flight Center | |
| date accessioned | 2017-09-04T16:45:07Z | |
| date available | 2017-09-04T16:45:07Z | |
| date copyright | 01/22/2001 | |
| date issued | 2001 | |
| identifier other | VYWIJBAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std/handle/yse/108469 | |
| description abstract | This detailed process instruction (DPI) is to be used for bonding flexible reusable surface insulation (FRSI) in accordance with X38-DPS design requirements. This DPI addresses the surface preparation and bonding of FRSI material to substrate surface(s). | |
| language | English | |
| title | MSFC-PROC-3144 | num |
| title | DETAILED PROCESS INSTRUCTION FOR BONDING FLEXIBLE REUSABLE SURFACE INSULATION (FRSI) WITH RTV 566 | en |
| type | standard | |
| page | 14 | |
| status | Active | |
| tree | MSFC - NASA - MSFC - Marshall Space Flight Center:;2001 | |
| contenttype | fulltext |