MSFC-PROC-3144

DETAILED PROCESS INSTRUCTION FOR BONDING FLEXIBLE REUSABLE SURFACE INSULATION (FRSI) WITH RTV 566

contributor author	MSFC - NASA - MSFC - Marshall Space Flight Center
date accessioned	2017-09-04T16:45:07Z
date available	2017-09-04T16:45:07Z
date copyright	01/22/2001
date issued	2001
identifier other	VYWIJBAAAAAAAAAA.pdf
identifier uri	http://mapnamagz.yabesh.ir/std/handle/yse/108469
description abstract	This detailed process instruction (DPI) is to be used for bonding flexible reusable surface insulation (FRSI) in accordance with X38-DPS design requirements. This DPI addresses the surface preparation and bonding of FRSI material to substrate surface(s).
language	English
title	MSFC-PROC-3144	num
title	DETAILED PROCESS INSTRUCTION FOR BONDING FLEXIBLE REUSABLE SURFACE INSULATION (FRSI) WITH RTV 566	en
type	standard
page	14
status	Active
tree	MSFC - NASA - MSFC - Marshall Space Flight Center:;2001
contenttype	fulltext