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TIA TIA-455-71A

FOTP-71 Procedure to Measure Temperature- Shock Effects on Fiber Optic Components

Organization:
TIA - Telecommunications Industry Association
Year: 2008

Abstract: This procedure describes a method for conducting temperature-shock testing on fiber optic components such as connectors and branching devices. It may also be used for optical fiber cable or optical fiber when specified for U.S. military or similar applications.
This procedure is specifically intended to measure and evaluate changes that may occur after exposure to a specified number of temperature-shock cycles. It is not intended to monitor product performance on a continuous or semicontinuous basis during temperature soaking.
The test for gradual temperature cycling, and monitoring during temperature excursions, is defined in FOTP-3.
URI: http://mapnamagz.yabesh.ir/std;query=autho1826AF676/handle/yse/82181
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contributor authorTIA - Telecommunications Industry Association
date accessioned2017-09-04T16:18:42Z
date available2017-09-04T16:18:42Z
date copyright10/01/1999 (R 2008)
date issued2008
identifier otherTGHYKCAAAAAAAAAA.pdf
identifier urihttp://mapnamagz.yabesh.ir/std;query=autho1826AF676/handle/yse/82181
description abstractThis procedure describes a method for conducting temperature-shock testing on fiber optic components such as connectors and branching devices. It may also be used for optical fiber cable or optical fiber when specified for U.S. military or similar applications.
This procedure is specifically intended to measure and evaluate changes that may occur after exposure to a specified number of temperature-shock cycles. It is not intended to monitor product performance on a continuous or semicontinuous basis during temperature soaking.
The test for gradual temperature cycling, and monitoring during temperature excursions, is defined in FOTP-3.
languageEnglish
titleTIA TIA-455-71Anum
titleFOTP-71 Procedure to Measure Temperature- Shock Effects on Fiber Optic Componentsen
typestandard
page26
statusActive
treeTIA - Telecommunications Industry Association:;2008
contenttypefulltext
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