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TIA TIA/EIA-455-4C

FOTP-4 Fiber Optic Component Temperature Life Test

Organization:
TIA - Telecommunications Industry Association
Year: 2002

Abstract: The intent of this test is to determine the effects on the optical and mechanical characteristics of fiber optic components resulting from exposure to an elevated temperature for a specific length of time.(Footnote 1) The procedure is applicable to all types of fiber optic devices including connectors, splices, passive branching devices (couplers), etc.
Footnote 1 This method is similar to method 1005.1 of MIL-STD-1344A, except that this procedure includes supplementary measurements.
URI: http://mapnamagz.yabesh.ir/std;query=autho1826AF676/handle/yse/105634
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    TIA TIA/EIA-455-4C

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contributor authorTIA - Telecommunications Industry Association
date accessioned2017-09-04T16:42:20Z
date available2017-09-04T16:42:20Z
date copyright06/01/2002
date issued2002
identifier otherBSGZXAAAAAAAAAAA.pdf
identifier urihttp://mapnamagz.yabesh.ir/std;query=autho1826AF676/handle/yse/105634
description abstractThe intent of this test is to determine the effects on the optical and mechanical characteristics of fiber optic components resulting from exposure to an elevated temperature for a specific length of time.(Footnote 1) The procedure is applicable to all types of fiber optic devices including connectors, splices, passive branching devices (couplers), etc.
Footnote 1 This method is similar to method 1005.1 of MIL-STD-1344A, except that this procedure includes supplementary measurements.
languageEnglish
titleTIA TIA/EIA-455-4Cnum
titleFOTP-4 Fiber Optic Component Temperature Life Testen
typestandard
page22
statusActive
treeTIA - Telecommunications Industry Association:;2002
contenttypefulltext
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