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System Architectures and Fluids for High Heat Density Cooling Solutions

contributor authorASHRAE - American Society of Heating, Refrigerating and Air-Conditioning Engineers, Inc.
date accessioned2017-09-04T18:43:55Z
date available2017-09-04T18:43:55Z
date copyright01/01/2010
date issued2010
identifier otherKDFIRCAAAAAAAAAA.pdf
identifier urihttp://mapnamagz.yabesh.ir/std;query=authoF23793FD08/handle/yse/225316
description abstractINTRODUCTION
According to ASHRAE's publication "Datacom Equipment Power Trends and Cooling Applications", by 2010, computer and communications rack heat loads are projected to reach 15 to 48 kW heat load per rack.
Driving this trend is the fact that advances in technology are allowing more and more computing power to be placed into smaller and smaller packages. Other contributing factors include the trend of businesses to reduce capital costs by putting virtualized servers in smaller spaces, and consolidation of multiple remote data centers into centralized mega data centers. This compaction increases power requirements thereby generating more heat.
languageEnglish
titleASHRAE OR-10-004num
titleSystem Architectures and Fluids for High Heat Density Cooling Solutionsen
typestandard
page8
statusActive
treeASHRAE - American Society of Heating, Refrigerating and Air-Conditioning Engineers, Inc.:;2010
contenttypefulltext


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