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Specification for Immersion Tin Plating for Printed Circuit Boards - Incorporates Amendment 1: January 2012

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T15:11:30Z
date available2017-09-04T15:11:30Z
date copyright01/01/2007
date issued2007
identifier otherLUMGUEAAAAAAAAAA.pdf
identifier urihttp://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/9931
description abstractThis specification sets the requirements for the use of Immersion Tin (ISn) as a surface finish for printed circuit boards. It is intended for use by supplier, manufacturer, contract manufacturer (CM) and original equipment manufacturer (OEM).
languageEnglish
titleIPC 4554num
titleSpecification for Immersion Tin Plating for Printed Circuit Boards - Incorporates Amendment 1: January 2012en
typestandard
page56
statusActive
treeIPC - Association Connecting Electronics Industries:;2007
contenttypefulltext


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