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IPC TM-650 2.3.15D
Purity, Copper Foil or Plating
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:25:22Z | |
| date available | 2017-09-04T16:25:22Z | |
| date copyright | 05/01/2004 | |
| date issued | 2004 | |
| identifier other | TXOHFBAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/88611 | |
| description abstract | This is an electrogravimetric method for determining the purity of copper foil or plating. | |
| language | English | |
| title | IPC TM-650 2.3.15D | num |
| title | Purity, Copper Foil or Plating | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2004 | |
| contenttype | fulltext |
