IPC CI-408

Abstract

With the present packaging trend in systems moving towards high speed, compact configurations, the use of Surface Mount Technology offers a viable approach toward achieving the desired packaging goals. The degree of advancement in packaging of electronic components is predicated on the type of product being produced; the need for miniaturization and weight savings; plus the off-theshelf availability of different component types. The growing popularity of surface mount technology for packaging electronics has raised a need for surface mount connectors to produce a common packaging approach. As higher density (0.51 mm [0.020 in] centerline and below), higher electrical performance systems become more common, traditional connector manufacturing technologies such as stamped and formed contacts and associated moldings are approaching density limits that are going to have to be overcome. Solderless surface mount interconnects appear capable of overcoming many of these limitations. Additional environmental benefits include reduction of lead content in assemblies and elimination of postsolder cleaning. This document provides guidelines for the design, selection and application of solderless surface mount connectors and interconnections for all types of printed boards, rigid, flexible-rigid and backplanes.