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English -- Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices - Incorporates Amendment 1: January 2007;
Russian -- Обращение, упаковка, транспортировка и использование компонентов для поверхностного монтажа, чувствительных к влаге при пайке методом оплавления - Incorporates Amendment 1: January 2007

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T16:08:57Z
date available2017-09-04T16:08:57Z
date copyright38626
date issued2005
identifier otherSFKEUCAAAAAAAAAA.pdf
identifier urihttp://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/72176
languageRussian
titleIPC IPC/JEDEC J-STD-033B.1 RUSSIANnum
titleEnglish -- Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices - Incorporates Amendment 1: January 2007en
titleRussian -- Обращение, упаковка, транспортировка и использование компонентов для поверхностного монтажа, чувствительных к влаге при пайке методом оплавления - Incorporates Amendment 1: January 2007other
typestandard
page28
statusActive
treeIPC - Association Connecting Electronics Industries:;2005
contenttypefulltext


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