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IPC TM-650 2.4.34.2
Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:05:05Z | |
| date available | 2017-09-04T16:05:05Z | |
| date copyright | 01/01/1995 | |
| date issued | 1995 | |
| identifier other | RVDNCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/68364 | |
| description abstract | The test specifies a standard procedure for determining the viscosity of solder paste in the range of 300,000 to 1,600,000 centipoise. | |
| language | English | |
| title | IPC TM-650 2.4.34.2 | num |
| title | Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise) | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1995 | |
| contenttype | fulltext |
