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Specification for Base Materials for High Speed/High Frequency Applications - Incorporates Amendment 1

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T16:04:59Z
date available2017-09-04T16:04:59Z
date copyright2014.01.01
date issued2014
identifier otherRUTOHFAAAAAAAAAA.pdf
identifier urihttp://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/68237
description abstractThis specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital electrical and electronic circuits. This specification applies to the plastic substrate thickness defined in the specification sheets as measured over the dielectric only. As a general guideline, laminates controlled by this specification usually have a dissipation factor of less than 0.005.
languageEnglish
titleIPC 4103Anum
titleSpecification for Base Materials for High Speed/High Frequency Applications - Incorporates Amendment 1en
typestandard
page68
statusActive
treeIPC - Association Connecting Electronics Industries:;2014
contenttypefulltext


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