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IPC TM-650 2.4.42.1
High Temperature Mechanical Strength Retention of Adhesives
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:03:17Z | |
| date available | 2017-09-04T16:03:17Z | |
| date copyright | 03/01/1988 | |
| date issued | 1988 | |
| identifier other | RQCZCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/66554 | |
| description abstract | The object of this test is to determine the component hold-down capability of the adhesive material at wave soldering temperatures due to material softening or degradation. Test coupons are assembled using the adhesive material and 1206 size chip resistors. The test coupons are preheated then floated on a solder pot, after which the loss of any components is noted. | |
| language | English | |
| title | IPC TM-650 2.4.42.1 | num |
| title | High Temperature Mechanical Strength Retention of Adhesives | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1988 | |
| contenttype | fulltext |
