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IPC TM-650 2.4.41.3
In-Plane Coefficient of Thermal Expansion, Organic Films
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:08:28Z | |
| date available | 2017-09-04T15:08:28Z | |
| date copyright | 07/01/1995 | |
| date issued | 1995 | |
| identifier other | LKZLCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/6327 | |
| description abstract | Scope This test method establishes a procedure for determining the in-plane coefficient of linear thermal expansion of organic films from 0-200°C using thermal mechanical analysis (TMA). | |
| language | English | |
| title | IPC TM-650 2.4.41.3 | num |
| title | In-Plane Coefficient of Thermal Expansion, Organic Films | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1995 | |
| contenttype | fulltext |
