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IPC TM-650 2.6.6B
Temperature Cycling, Printed Wiring Board
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:58:20Z | |
| date available | 2017-09-04T15:58:20Z | |
| date copyright | 32112 | |
| date issued | 1987 | |
| identifier other | RCNADAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/61519 | |
| description abstract | This test is conducted for the purpose of determining the resistance of a material such as a laminate or multilayer circuit board, to the shock of repeated exposures to extremes of high and low temperatures for comparatively short periods of time. | |
| language | English | |
| title | IPC TM-650 2.6.6B | num |
| title | Temperature Cycling, Printed Wiring Board | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1987 | |
| contenttype | fulltext |
