درباره ما
IPC TM-650 2.4.8.4
Carrier Release, Thin Coppe
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:55:44Z | |
| date available | 2017-09-04T15:55:44Z | |
| date copyright | 01/01/1990 | |
| date issued | 1990 | |
| identifier other | QVWQCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/59082 | |
| description abstract | To determine the release strength of the carrier of thin copper foil in pounds per inch of width at ambient temperature. | |
| language | English | |
| title | IPC TM-650 2.4.8.4 | num |
| title | Carrier Release, Thin Coppe | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1990 | |
| contenttype | fulltext |
