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IPC S-816
SMT Process Guideline and Checklist
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:50:02Z | |
| date available | 2017-09-04T15:50:02Z | |
| date copyright | 07/01/1993 | |
| date issued | 1993 | |
| identifier other | QFTGCAAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/53061 | |
| description abstract | This document is intended to provide guidelines and assistance in performing and troubleshooting the steps involved in the process of producing printed wiring assemblies incorporating surface mounting attachment of components. Each section contains a list of problems ofien observed during a specific part of the surface mount assembly process. The list of observed symptoms is matched by a description of causes often acsociated with the symptoms. Suggestions for correction are also included. These solutions may be related to the equipment, materials, or design. Accordingly, some of these corrective measures cannot be implemented on the shop floor. | |
| language | English | |
| title | IPC S-816 | num |
| title | SMT Process Guideline and Checklist | en |
| type | standard | |
| page | 46 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1993 | |
| contenttype | fulltext |
