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IPC TM-650 2.6.3.1E
Solder Mask - Moisture and Insulation Resistance
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T15:49:55Z | |
| date available | 2017-09-04T15:49:55Z | |
| date copyright | 03/01/2007 | |
| date issued | 2007 | |
| identifier other | QFHVACAAAAAAAAAA.pdf | |
| identifier uri | http://mapnamagz.yabesh.ir/std;query=autho1826AF6708/handle/yse/52914 | |
| description abstract | This test method is used to determine the moisture and insulation resistances of applied polymer solder mask under two separate prescribed conditions of temperature and humidity. One condition is described as Class T and the other Class H. Raw material qualification testing is performed on designated comb patterns. Production quality conformance testing is performed on a standard ‘‘Y'' pattern. | |
| language | English | |
| title | IPC TM-650 2.6.3.1E | num |
| title | Solder Mask - Moisture and Insulation Resistance | en |
| type | standard | |
| page | 5 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2007 | |
| contenttype | fulltext |
